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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers

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UHF Rogers RF Pcb Board With ER = 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers

Brand Name : XCE
Model Number : XCE GR
Certification : CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : MOQ 1 Piece
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 1000000 pieces per week
Delivery Time : 5-10 working days
Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color : Green
Material : Rogers Mixed Material
Layer : Multilayer
Board Size : 48*35cm
Copper Thinknes : 1 oz
Min Line Width : 4 mil
Min Line Space : 4mil
Surface Finish : Immersion Gold Over Nickel, Carbon Print
Drill : Blind & Buried Vias
Name : Rogers Mixed Fr4 Pcb
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UHF Rogers RF Pcb Board With ER= 3.38 Blind Buried Via Hole 1.524 MM Used In Wireless Couplers


Products Details


Raw MaterialRogers
Layer CountMultilayer
Board Thickness1.524 mm
Copper Thickness1 oz
Surface FinishImmersion Gold Over Nickle
Solder MaskGreen
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement480*350 mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PCB Capability


Layer1-30L
MaterialCEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material,Copper Clad Laminate ,Rogers ,Neclo, Taconic and Isola pcb .
Board Thinckness0.2-6mm
Max Finish Size450*508mm
Min. Drill Hole Size0.25mm
Min. Line Width0.075mm(3mil)
Min. Line Spacing0.075mm(3mil)
Surface finishHAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
Copper thickness0.5-4.0 Oz
Solder mask colorgreen/black/white/red/blue/yellow
Inner packingVacuum packing, Plastic Bag
Outer packingstandard carton packing
Hole tolerancePTH:±0.076,NTPH:±0.05
CertificateISO9001,SGS
Profiling punchingRouting,V-CUT,Beveling

PrePreg Material

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s
LW Acoustic impedance6.64 MRayl


Compared Data :

ModelERTanδ@ 1GHzCter (ppm/℃)

CTE (X,Y)

(ppm/℃)

FR4Normal4.60.03017
FR4PCL370(FR4-HTG)4.30.00155117
FR4117 (FR4-HTG)4.40.01317
Park NecloN4000-6-FC BC (FR4-HTG)4.10.001516




Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.



Product Tags:

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