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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards

Shenzhen Xinchenger Electronic Co.,Ltd
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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards

Brand Name : XCE
Model Number : XCEH
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : Rogers Multilayer pcb
Brand : XCE
Origin : China
Copper THK : 1OZ
Name : Multilayer pcb printed circuit boards
Line width : 3mil
Line space : 3mil
Application : High frequency rogers pcb field
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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards


Advantage


Multilayer rogers pcb printed circuit board


1.Sufficient high frequency material raw

2. PCB Have the comprehensive quality control system

3. PCB good price

4. PCB quick turn delivery time from 48hours.

5. PCB certification(ISO/UL E354810/RoHS)

6. 12 years experience in exporting service

7. PCB is no MOQ/MOV.

8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting


Multilayer pcb circuit boards :4Layer -36 layer


We can supply:


Rogers High Frequency Laminate/Material

High frequency pcb manufacture

PCB assembly


Specification:


Layer: 10

Color: black

Line width: 3mil

Line space: 3mil

Hole: 0.15MM


Multilayer pcb

Rogers Multilayer pcb Which widely be used for :

Automotive Antennas / RFID

Back-up Aids
Collision Avoidance
Low-Noise Block Downconverter (LNB)
Mobile Infrastructure Antennas
Point to Point Digital Radios
Power Amplifiers
High Reliability

Airborne Antenna Systems
Broadcast Satellites
Ground Based Radar Systems
Millimeter Wave Applications
Missile Guidance Systems
High Speed Digital


XCE PCB technical specification
Annual stock meterialRogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Product Tags:

multi layered pcb

      

multilayer pcb fabrication

      
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HDI Multilayer PCB Rogers ENIG High Frequency High Density Interconnect PCB Circuit Boards Images

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