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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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RF Rogers Material 6 Layer pcb ER =2.2 Amplified HDTV Indoor Antenna PCB With 1 oz 0.8 MM

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RF Rogers Material 6 Layer pcb ER =2.2 Amplified HDTV Indoor Antenna PCB With 1 oz 0.8 MM

Brand Name : XCE
Model Number : XCE BK888
Certification : CE,ROHS,FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : MOQ 1 Piece
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 1000000 pieces per week
Delivery Time : 5-10 working days
Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package
Color : Green
Material : Rogers Material
Layer : 6
Board Size : 45*36cm
Copper Thinknes : 1 oz
Min Line Width : 4 mil
Min Line Space : 4mil
Surface Finish : Electroless Nickel Immersion Gold
Name : Rogers pcb
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RF Rogers Material 6 Layer pcb ER =2.2 Amplified HDTV Indoor Antenna PCB With 1 oz 0.8 MM


Products Details

Raw MaterialRogers
Layer Count6-Layer
Board Thickness0.8mm
Copper Thickness1.0oz
Surface FinishElectroless Nickel Immersion Gold
Solder MaskBlack
SilkscreenWhite
Min. Trace Width/Spacing0.075/0.075mm
Min. Hole Size0.25mm
Hole Wall Copper Thickness≥20μm
Measurement450×360mm
PackagingInner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps
ApplicationCommunication,automobile,cell,computer,medical
AdvantageCompetitive Price,Fast Delivery,OEM&ODM,Free Samples,
Special RequirementsBuried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable
CertificationUL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

Parameter:


ModelParameterthickness(mm)Permittivity(ER)
F4BF4B0.382.2
F4B0.552.23
F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
F4Bk0.8,1.52.65
F4B0.83.5
FE=F4BM12.2
RogersRO58800.254 0.508 0.7622.20 ± 0.02
RO43500.254 0.508,0.8,1.5243.5
RO40030.5083.38
TACONICTLF-350.83.5
TLA-60.254,0.8,1,1.5,2.65
TLX-80.254,0.8,1,1.62.55
RF-60A0.646.15
TLY-50.254,0.508,0.82.2
TLC-320.8,1.5,33.2
TLA-350.83.2
ARLONAD255C06099C1.52.55
MCG0300CG0.83.7
AD0300C0.83
AD255C03099C0.82.55
AD255C04099C12.55
DLC22012.2



PrePreg Material

ParameterValue
Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
Water absorption−0.125 in < 0.10%
Temperature index140 °C (284 °F)
Thermal conductivity, through-plane0.29 W/(m·K), 0.343 W/(m·K)
Thermal conductivity, in-plane0.81 W/(m·K), 1.059 W/(m·K)
Rockwell hardness110 M scale
Bond strength> 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
Izod impact strength - LW> 54 J/m (10 ft·lb/in)
Izod impact strength - CW> 44 J/m (8 ft·lb/in)
Compressive strength - flatwise> 415 MPa (60,200 psi)
Dielectric breakdown (A)> 50 kV
Dielectric breakdown (D48/50)> 50 kV
Dielectric strength20 MV/m
Relative permittivity (A)4.8
Relative permittivity (D24/23)4.8
Dissipation factor (A)0.017
Dissipation factor (D24/23)0.018
Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperatureCan vary, but is over 120 °C
Young's modulus - LW3.5×106 psi (24 GPa)
Young's modulus - CW3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis1.4×10−5 K−1
Coefficient of thermal expansion - y-axis1.2×10−5 K−1
Coefficient of thermal expansion - z-axis7.0×10−5 K−1
Poisson's ratio - LW0.136
Poisson's ratio - CW0.118
LW sound speed3602 m/s
SW sound speed3369 m/s
LW Acoustic impedance6.64 MRayl



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.


Product Tags:

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