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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White

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Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White

Brand Name : XCE
Model Number : XCER
Certification : CE,ROHS, FCC,ISO9008
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : Rogers3003
Color : green/white
Layer : 4
Origin : China
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Half Hole High Frequency Rogers PCB Ro3003 Multilayer Circuit Board


Size: 10*2cmOrigin: Shenzhen,China
Model: XCERNumber of layer: 4
Solder mask: greenSilk screen: white
Surface finish: HASLCu thickness: 2OZ
Min line space: 5milMil line width: 5mil

Quick details:

Quote as your detail information(like layer, material raw,board thickness&size,copper thickness)

It's better to send us gerber file,then can get accurate price.

Send you quotation within 24 hours,then you can confirm it.

If our price approved by you,then arrange the payment

Once we got the payment,we will made the production.

Generally 2/4 layer pcb 3-5 days,more then 6 layer 7-10 days


Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Special technologyInpedance,blind buried via,thick gold,aluminumPCB
Surface finishHASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


1. pcb design and pcb layout;

2.pcb manufacturing;
3. electronic components procurement;
4. pcb assembly & pcba manufacturing;
5. functional testing.

Product Tags:

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